Odisha to sign pact with Hsinchu Science Park
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18/07/2012
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Business Standard (New Delhi)
To give a boost to electronic hardware production, the state government will soon sign a memorandum of understanding (MoU) with Taiwan based Hsinchu Science Park, one of the world’s renowned hubs for semiconductor manufacturing, for exchange of information and technology.
“We may sign a MoU with Hsinchu Science Park within next one month for free flow of information and technology to facilitate establishment of semiconductor units in the upcoming Info Valley complex in Bhubaneswar,” said BK Patnaik, Chief Secretary.
He was speaking at a one day workshop on Electronic System Design Manufacturing organized by India Semiconductor Association (ISA), Department of Electronics and IT, Government of India, Software Technology in India (STPI) and state department of information technology.
To lure Taiwan investors to the state, a four-member delegation of the Odisha government led by the Chief Secretary had visited Taiwan during February 12 - 18. The other members of the team were C J Venugopal, chairman and managing director (CMD), Industrial Promotion and Investment Corporation Ltd (Ipicol), P K Jena, the then IT secretary and B N Palai, general manager of Ipicol.
The state government has partnered India Semiconductor Association (ISA) for preparing a road map for electronic system design manufacturing (ESDM) within six months. Experts say, the demand for electronic in the Indian market was $ 45 Billion in 2008-09 and is expected to reach $ 400 Billion by 2020. Indian electronics hardware production constitutes only around 1.31 per cent of the global production.
The mobile revolution, increase in manufacturing capacities to meet local demand for consumer durables, enhanced government spend on aerospace and defence and emphasis on energy efficiency equipments are the key trends influencing the growth in Indian electronic market, the experts observed.